TITAN NANOFILL™

Titan Nanofill™ - Advanced Technology for a Generation of 'Super Plastics'

Increasing barrier properties can potentially double the shelf life of organic materials inside packaging for increased values, creating a game changer for the packaging industry.

BARRIER PROPERTIES IN PACKAGING USING NANOTECHNOLOGY

HOW IT WORKS

Nanotechnology represents a physical barrier to gas exchanges in polymer materials, but only if the particles are properly exfoliated.

Titan Nanofill™

Excellent Dispersion
Low Cost
No Cofactors Required

OUR MATERIALS CAN BE:
BIOEDEGRADABLE / NON-BIODEGRADABLE

FLEXIBLE / RIGID

Polymer material with agglomerated nanoparticles

H2O

VOCs

1 gram nanoparticle contains between 700ft2 - 1500 ft2 surface area

Polymer material with exfoliated well-dispersed particles

H2O

VOCs

PRACTICAL ADVANTAGES OF NANOCOMPOSITES

1) Reduction of layers in multilayer packaging

Weight
Cost
Savings

2) Recyclability of Packaging Improved

Longer Resin Re-use Cycle

Glass Nano Sphere Addition

Dispersed nanoparticles vectoring glass particles inside polymer matrix

THE INCREDIBLE VALUE OF TITAN NANOFILL™

The global agenda calls for active and real solutions to solve plastic pollution. With less than 1% of scientists globally with the expertise to seamlessly disperse Nano technology into biomaterials. Titan inserts technology solutions to maximize the commercialization of healthy polymers, leading the industry by providing a broad range of formulation replacements and adaptive additives with Nano Technology.

Titan Nanofill ™ Technology provides the following benefits:

Increased barrier properties against UV Degradation by 100%+
Increased barrier properties against Moisture by 100%+
Increased barrier properties against Oxygen by 100%+
Use less material for cost savings while maintaining mechanical and product properties

Increasing barrier properties can double the shelf life of organic materials inside packaging for increased values on a shelf, creating a game changer to the packaging industry.